Engineered
Assemblies
Richardson's experienced power conversion engineers are available to design
both air and water-cooled assemblies to your specifications with a wide
range of options that include:
- Front-end Controlled/Uncontrolled Bridges
- Laminated Bus Structures
- Optimized Gate Drives
- Bus Capacitors
- Current Measurements
- Thermally Designed Heat Sinks
- Latest Generation IGBTs
Additional power semiconductor assemblies utilizing SCR diodes, GTOs
and MOSFETs are also available.
Each assembly is manufactured in our new ISO registered ESD production
area, which utilizes the latest IGBT technology coupled with optimized
passive and mechanical components. Richardson's extensive inventory of
power conversion products and engineering expertise serves to reduce
your development cost and time to market. |
Standard
Assemblies
 Designed
with common devices and materials, these standard assemblies address many
different applications. Our standard assemblies are available in both air
and water-cooled versions and can be integrated to form many different circuit
types.
Each assembly is factory tested and shipped ready for installation. |
Build
to Print Assemblies
Our engineering team will fabricate your assembly to the print specifications,
while closely following ISO procedures.
We will work closely with you to optimize the assembly design by using
the best available components to meet or exceed the specifications.
Each assembly will be manufactured in our new ESD production facility
and shipped ready for installation. In-house capabilities for machining,
chemical processing and finishing, as well as metal joining operations,
will reduce your manufacturing leadtimes. |
